SMT and THT Lines
The production of electronic boards takes place in two stages, SMT (Surface Mount Technology) and THT (Through Hole Technology).
New generation machines are utilized for speed, assembly precision, repeatability and traceability.
Karel production lines are installed with fully automated SPI (solder paste inspection), 3D AOI automated optical inspection systems, 3D AXI automated X-Ray inspection systems and In-Circuit Test (ICT) systems, which are the requirements of automotive electronics production. In the field of THT (Through Hole Technology) components use selective soldering or wave soldering processes.
For many years, Karel has also been successfully implementing solderless connection technology, which is based on press-fitting suitable components onto PCBs. This technology is characterized by good conductivity and superior mechanical strength, making it possible in the future to equip the appropriate components on many electronic boards with clean connections without soldering.